The Interchangeable kit has a modular structure. It consists of pressure plate (AP), moving plate (PAP) and probe plate (KTP) and socket protection plate (HSP).
KTP from CEM1
Incl. holder for internal CONTACT PIN interface (max. 5 interface blocks)
including wire protection plate
Product area: 260x160mm
Plate material thickness: 10mm
PAP from EGS-AS
Incl. spring pads and 10 spacers
Product area: 520x250mm
External dimensions: 336x209mm
Plate material thickness: 5mm
AP made of ESD acrylic glass
Product area: 295x180mm
Plate material thickness: 15mm
HSP made of acrylic glass
Incl. Mounting material
External dimensions: 321x182mm
Plate material thickness: 3mm
